发明名称 STACKED PACKAGE TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To eliminate the displacement of upper and lower semiconductor devices and the electrically improper opening of the upper device due to the end of leads by forming slots or recesses for preventing the displacement of positions on the lower leads of the position that the leads of upper and lower stages are superposed. CONSTITUTION:Slots or recesses 3 are formed at the portion where external leads 2 are superposed, and the leads 2 of the semiconductor device 1 of upper stage are engaged with the slots or recesses 3 of the leads 2 of the semiconductor device 1 of lower stage. Thus, the displacement of upper and lower stages and the improper opening due to the bent of the leads can be prevented.
申请公布号 JPS6032350(A) 申请公布日期 1985.02.19
申请号 JP19830141673 申请日期 1983.08.02
申请人 NIPPON DENKI KK 发明人 SUYAMA YOSHIMITSU
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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