,申请号JP19720042107-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称
摘要
申请公布号	JPS5539822(B1)	申请公布日期	1980.10.14
申请号	JP19720042107	申请日期	1972.04.26
申请人		发明人
分类号	G03C1/33;G03C1/34;(IPC1-7):G03C1/34	主分类号	G03C1/33
代理机构		代理人
主权项
地址

您可能感兴趣的专利

USE OF ALKYL PERFLUOROALKENE ETHERS AND MIXTURES THEREOF IN HIGH TEMPERATURE HEAT PUMPS

BONDPLY ADHESIVE COMPOSITION

METAL NANOPLATE, A METHOD FOR PREPARING THE SAME, A CONDUCTIVE INK COMPOSITION, AND A CONDUCTIVE FILM COMPRISING THE SAME

NANOCELLULAR AND NANOCELLULAR PARTICLE FILLED POLYMER COMPOSITE COATING FOR EROSION PROTECTION

ARTICLE OF MANUFACTURE CONTAINING A FLAME RETARDANT FILLER PREPARED FROM A BRIDGED POLYSILSESQUIOXANE

METHODS OF PRODUCING POLYURETHANE THREE-DIMENSIONAL OBJECTS FROM MATERIALS HAVING MULTIPLE MECHANISMS OF HARDENING

POLYORGANOSILOXANE-CONTAINING GRAFT COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED PRODUCT

LOW-EMISSION, STABILIZED POLYURETHANE

POLYARYLENE SULFIDE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME

Formation of Superhydrophobic Surfaces

HOT-MELT ADHESIVE AND USE THEREOF

FIBER-REINFORCED COMPOSITE

HYPERBRANCHED POLYMERS

METHOD FOR PRODUCING ALIPHATIC OR PARTIALLY AROMATIC POLYAMIDES, SAID METHOD COMPRISING A SOLID-PHASE POLYMERIZATION PROCESS

PROCESS FOR PRODUCING A SEMI-AROMATIC SEMI-CRYSTALLINE POLYAMIDE

COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD

POLYMERIZABLE OLIGOMER AND PHOTORESIST COMPOSITION COMPRISING THE SAME

ANTI CD37 ANTIBODIES

MONOCLONAL ANTIBODIES THAT REACT WITH THE CAPSULE OF BACILLUS ANTHRACIS

COSMETIC COMPOSITION FOR IMPROVING SKIN CONDITIONS COMPRISING FUSION PROTEIN