| 摘要 |
<p>PURPOSE:To form a marking which ca be easily visible on ICs of many types without damaging a wafer by forming a character or symbol of the making on a semiconductor substrate by using a beam emitted from an emission source. CONSTITUTION:A laser light 6 emitted from a laser emitting unit 5 is emitted through a mask plate 7 to an IC which becomes improper as a result of a measurement. The plate 7 is formed by forming a light shielding film 9 on a transparent plate 8 made of quartz or the like, and the film 9 is formed of a substance which shields the laser light, the substance which does not vary by the laser light is selected, and is formed only the portion except the shape of ''X'' which shows the defective product.</p> |
