| 摘要 |
PURPOSE:An epoxy resin composition excellent in moisture resistance, rust prevention, adhesion, etc., and suitable for sealing semiconductor devices, obtained by mixing an epoxy resin with a curing agent and lanolin (derivative). CONSTITUTION:The purpose epoxy resin composition is obtained by mixing (A) an epoxy resin selected from the group consisting of glycidyl ether epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, etc., with (B) a curing agent (e.g., phthalic anhydride or m-phenylenediamine), and (C) 0.1-10pts.wt., per 100pts.wt. component A, lanolin and/or its derivative (e.g., calcium lanolate or magnesium lanolate). When this resin composition is used as a sealant or the like, component C intervenes between the resin composition and an adherend to exhibit an effect of preventing penetration of external moisture, ionic impurities, etc. |
