发明名称 BONDING WIRE
摘要 PURPOSE:To obtain a bonding wire, hot strength thereof has approximately cold strength of a high-purity gold wire and performance thereof as a high-speed bonder can be displayed at a maximum value, by using a gold alloy wire to which a specific quantity of sodium is added. CONSTITUTION:A gold alloy wire in which 0.0001-0.01wt% sodium is made to contain in not less than purity 99.99wt% gold is used. Both cold strength and hot strength augment with the increase of the content of sodium, but a ball shape is not formed to a true sphere when the content of sodium exceeds 0.01wt%. Its tensile strength is larger than that of a pure gold wire, and disconnection during wire drawing working is also reduced remarkably.
申请公布号 JPS6030160(A) 申请公布日期 1985.02.15
申请号 JP19830137591 申请日期 1983.07.29
申请人 SUMITOMO KINZOKU KOUZAN KK 发明人 KATOU YUTAKA
分类号 H01L21/60;H01L23/49 主分类号 H01L21/60
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