发明名称 MOLD FOR SEALING SEMICONDUCTOR WITH RESIN
摘要 PURPOSE:To prevent the generation of a hollow section in a cavity and the variance of moldability, and to shorten a cure time by equalizing the filling speed of a resin in multi-pot type runnerless one pot two cavity mold. CONSTITUTION:Branched gates 211, 212 mounted to the parting surface of a top force 1 are communicated with a recessed section 3 and a pot 6 through one outlet 22 while being communicated with cavities 81, 82. Accordingly, a resin is fed uniformly to the gates 211, 212 through the outlet 22 from the pot 6, and can be filled equally into the cavities 81, 82, and the generation of hollow sections in the cavities 81, 82 can be prevented. The resin is discharged in succession from the resin in the vicinity of the outlet 22, the melted resin remains on the side reverse to the outlet 22, and a cull 12 is formed by the resin melted at the initial stage of injection, thus shortening a cure time.
申请公布号 JPS6030143(A) 申请公布日期 1985.02.15
申请号 JP19830138317 申请日期 1983.07.28
申请人 TOSHIBA KK 发明人 FUJIZU TAKAO
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/26;B29L31/34 主分类号 H01L21/56
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