| 摘要 |
PURPOSE:To identify patterns accurately and avoid eroneous wire bonding by a method wherein identification marks are provided in or near the bonding pads and bonding positions are determined by the pattern identification of those marks. CONSTITUTION:Near a bonding pad 4 of a group of bonding pads 4 positioned at a far end, an identification mark 7 for pattern identification is provided. The identification mark 7 is provided also near a bonding pad 4 of the bonding pads in a facing row also positioned at the far ends. When a leadframe on a substrate and the bonding pads 4 are wire-bonded with wires such as gold wires, the identification mark 7 provided near the bonding pad 4 formed on a semiconductor pellet 3 is read by a TV camera and the like for pattern identification to determine the bonding position and the leadframe and the bonding pads 4 are wire-bonded by a bonder. |
