首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
JPS574617(B2)
申请公布日期
1982.01.27
申请号
JP19760027060
申请日期
1976.03.15
申请人
发明人
分类号
C07C69/738;C07C45/00;C07C45/65;C07C49/00;C07C67/00
主分类号
C07C69/738
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Three dimensional resistive memory
Pixel array area optimization using stacking scheme for hybrid image sensor with minimal vertical interconnects
Package on package structure
Organic light-emitting display apparatus having high aperture ratio
Display panel with fewer data lines
Anti-fuse memory cell
Method for producing a semiconductor component
Co-support for XFD packaging
Method and system for bonding 3D semiconductor device
Semiconductor device with single-event latch-up prevention circuitry
Apparatus for high speed signal processing interface
Semiconductor device and method of manufacturing the same
Interactive reward associated with a broadcast
Area-based encoding/decoding device and method
Solid-state image pickup device and driving method thereof, and electronic apparatus
Photoelectric conversion apparatus and imaging system
Digital 3D/360 degree camera system
Lens apparatus and image pickup apparatus
Device and method for extracting information from characteristic signals
Valid replacement data in encoded video