| 摘要 |
In a semiconductor arrangement in an insulating housing comprising a semiconductor body containing one or more semiconductor components, the semiconductor body has, on its surface or on surface layers, conductor tracks which are coated with an insulating layer. The essence of the invention is that a layer of cured photoresist is situated between the material of the insulating housing and the insulating layer covering the conductor tracks. Preferably, the photoresist layer is the one used to produce the connection bonding vias in the insulating layer covering the conductor track system.
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