| 摘要 |
<p>A covering material is used which comprises two superposed unmiscible liquid phases (3, 4) at the soldering temperature. The lower phase (3) is obtained by spreading a powder of a chemically active compound which is solid at room temperature and liquid at soldering temperature, of sebacic acid and/or suberic acid or the esters thereof in the upper phase (4) which is comprised of a liquid synthetic polyalphaolefine.</p> |
