| 摘要 |
PURPOSE:To shorten the bonding time and to improve the positioning accuracy by carrying out the relative movement of a lead frame and a bonding head by moving a stage for the movement in one direction and moving a feeder for the movement in another direction. CONSTITUTION:A feeder 14 feeds the lead frame and the semiconductor substrate which are to be bonded from a loader 11 to the feeder 14 and then from the feeder 14 to an unloader 12. The feeder 14 is formed movably in X-axial direction of a bonding head 9 and is driven by an X-axial motor 8 fixed to the floor surface. The feeder 14 is brought close to the loader 11 and a lead frame 13 in a magazine of the loader 11 is transported onto the feeder 14. While the feeder 14 is moved in X-direction and the bonding head 9 is moved in Y-Z axial direction, a capillary 1 is brought near the bonding points of the lead frame 13 to make bonding. Accordingly, a locus of the bonding head becomes simple so that the accuracy and velocity are improved. |
