发明名称 Method and device of conducting a closed cycle of the bath for plating of coatings.
摘要 <p>The device for conducting a closed cycle of the electroplating bath, especially in the process of electroplating, comprising an electrolytic tank, an evaporation device connected with the electrolytic tank through a device feeding the electroplating bath, is characterized in that in the electrolytic tank or in the vicinity thereof heating devices (17) are comprised and in the evaporation chamber of the evaporation device (10) there are no heating devices, the evaporation chamber (2) of the evaporation device is horizontal and comprises a partition (3), the inlet (1) of the bath to the evaporation chamber is situated on the opposite side in relation to the partition (3), the evaporation chamber (2) comprises a perforated conduit (6) or conduits and/or conduits having porous walls, the evaporation chamber (2) is connected from the side of the partition (3) with a separator (4), the upper part of the separator (4) comprises a drop catcher (7), and the lower part of the separator (4) comprises a conduit (5) taking off the concentrated bath to the electrolytic tank (9), the heating device (17) in the tank being connected to a temperature-control system (14, 15, 16) for control of the temperature of the bath.</p>
申请公布号 EP0132719(A1) 申请公布日期 1985.02.13
申请号 EP19840108238 申请日期 1984.07.12
申请人 INSTYTUT MECHANIKI PRECYZYJNEJ 发明人 WASIAK, RYSZARD;KIESZKOWSKI, MAREK;CICHOWSKI, DARIUSZ;CIECKO, PAWEL;ZUBR, MACIEJ
分类号 C25D21/00;(IPC1-7):C25D21/00;C23G1/36;C25D19/00;C25D21/18;C25D21/10;C25D17/00 主分类号 C25D21/00
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