发明名称 COOLING DEVICE FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To obtain a device having an excellent cooling effect by arranging flat hollow bodies, lower end sections thereof have holes arranged in parallel, connecting the hollow bodies in a communicating manner through a ring, interposing fins among the hollow bodies in the upper section of the ring and fitting a tabular fin to the ring. CONSTITUTION:Long size plates 2, lower ends thereof have holes 2a, fins 8, 9, connecting walls 7, radiator fins 5, rings 4, 11 surrounding the holes 2a, tabular fins 6, 13 fitted to the rings 4, 11 and side plates 10 are set at predetermined positions, and brazed under vacuum simultaneously. An air reservoir 14 and pipes 17, 18 are welded. A heat dissipation section A is formed integrally by the upper sections of the rings 4 of flat hollow bodies 3 shaped in a communicating manner in parallel and the fins 5 and a tank B by the rings 4, 11, hollow body sections corresponding to the rings 4, 11 and the pipes 17, 18. A refrigerant C is encapsulated into the tank B. The generation of heat of an element boils the refrigerant C through fins 24 and Al powdered bodies 27, and dissipates the heat of the refrigerant, and the refrigerant is recovered into the tank B. Since the fins 6, 13 are joined with the rings 4, 11, cooling air uniformly flows among the hollow bodies 3, and heat is also dissipated from these hollow bodies, thus further increasing a cooling effect.
申请公布号 JPS6028253(A) 申请公布日期 1985.02.13
申请号 JP19830137151 申请日期 1983.07.27
申请人 SHIYOUWA ARUMINIUMU KK 发明人 HOSHINO RIYOUICHI;TANAKA HIROKI
分类号 H01L23/427;H01L23/44;H01L23/467 主分类号 H01L23/427
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