| 摘要 |
PURPOSE:To prevent the deterioration of the characteristics of a chip due to an electromagnetic field from the outside while also reducing the thermal resistance of a semiconductor device by previously forming a conductive thin-film containing a metal having high permeability to the surface of a case when the semiconductor chip is housed in an insulating vessel, on the outside thereof a large number of terminals are fitted, and the semiconductor device is manufactured. CONSTITUTION:A semiconductor chip is housed in a cerdip type or resin seal type case 2, on the outside thereof a large number of terminals 3 are fitted. A thin-film 1, which contains a metal having high permeability and consists of aluminum having excellent conductivity, etc., is applied on the surface of the case 2, and grounded. Accordingly, an effect on the semiconductor chip of an electromagnetic field is eliminated or weakened while heat dissipation is improved, and a temperature rise is reduced. |
