| 摘要 |
PURPOSE:To uniformize the flow of solder, and to improve adhesive properties between a wiring pattern on a substrate and a solder bump by changing the shape of the bump in response to the width of the pattern when the solder bump is formed to an LSI chip and the wiring pattern is bonded to the bump. CONSTITUTION:When bonding patterns 23 having large line width and bonding patterns 23' having small line width mutually running parallel are formed to an LSI chip 21 and solder bumps are shaped to the predetermined surfaces of these patterns, the following process is executed. That is, the large solder bumps 22 are formed on the patterns 23 having large line width, and the small solder bumps 22' are shaped on the patterns 23' having small line width. Accordingly, the width of the bonding patterns and the size of the bumps are kept in prescribed relationship, and the quality of an electronic part is stabilized. |
