摘要 |
PURPOSE:To improve the performance, by providing holes of waveguide construction through each of which an end of a microstrip line of a high frequency input/output terminal is projected and an airtight sealing cover for an entrance/ exit of a waveguide, for improving the heat dissipating effect. CONSTITUTION:A package main body 20 for airtight sealing forming a recess 201 at the center of which an MIC is mounted is provided with a DC bias terminal 4 for the MIC and a signal transmitting terminal 5. Further, a hole 203 of waveguide construction is formed at both ends of the main body 20 in lengthwise direction, an expanding slot 204 is formed on a partition wall between the hole 203 and the recess 201 and a notch 202 is formed at the end of the main body 20 in broadwise direction. A microstrip line 22 of a high frequency input/output terminal is formed at each expanding slot 204 between the hole 203 and the recess 201, the upper part of the main body 20 is covered with a metallic cover and the hole 204 of waveguide construction is sealed airtightly with a window of a quartz glass 23. Further, a part or all of the waveguide construction is filled in with a dielectric for improving the heat dissipating effect. |