发明名称 METHOD FOR SEALING SEMICONDUCTOR DEVICE
摘要 PURPOSE:To contrive to improve the productivity and the yield by the unnecessitating the working of temporary assembly by a method wherein a junction edge covering the outside the sealing of a package is formed at the seal edge of a cap by bending working, which caps is then welded to the package by parallel seaming. CONSTITUTION:The junction gear 11 partially covering the outside of the sealing 3 is formed at the seal edge 5 by bending working. Thereby, the positioning of the package 1, cap 4, and a solder 6 at the time of welding is carried out. The working of sealing is performed by fusing the solder 6 under pressure conduction to the edge 5 by means of a roller electrode 12 for parallel seam welding, after the edge 5 with the edge 11 formed is made to abut against the sealing 3 via solder 6, and then by joining the cap 4 to the package 1. Besides, junction can be performed also by a method wherein a metallic layer 13 is previously provided on the junction plane of the edge 5, and a metallic layer 14 on the junction plane of the sealing 3.
申请公布号 JPS6027149(A) 申请公布日期 1985.02.12
申请号 JP19830134801 申请日期 1983.07.22
申请人 MITSUBISHI DENKI KK 发明人 KONDOU TAKASHI;YAMA YOMIJI
分类号 H01L23/02;B23K11/06;H01L21/50 主分类号 H01L23/02
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