| 摘要 |
<p>PURPOSE:To provide resist ink for electroless plating which prevent copper release and has high reliability by consisting the name of an epoxy resin compsn. contg. a filler mixed with aluminum silicate having a prescribed grain size or below, a solid soln. of titanium oxide, nickel oxide and antimony oxide and ultrafine grain silica. CONSTITUTION:This resist ink is constituted of an epoxy resin compn. contg. a filler mixed with aluminum silicate having <=15mu grain size, a solid soln. of the above-described oxides and fine grain silica. More specification, the manufacture of a printed wiring board is accomplished by coating an adhesive agent contg. a platng catalyst such as Pd on a base plate such as a paper-phenolic resin laminate contg. a plating catalyst such as Pd then printing the above- described ink for resist thereon. Since the ink for resist has extremely fine particles, the ruggedness on the printed surface is small. Therefore if the surface is thereafter subjected to an electroless plating treatment, copper is hardly stickable to the surface of the resist ink and particularly the solid soln. and the ultrafine grain silica have the effect of making difficult the growth of copper particles sticking to the surface. The generation of copper release and the short circuiting defect occurring therefrom are thus suppressed.</p> |
