| 摘要 |
PURPOSE:To check a scattering condition having possibility to be generated at finger parts, and to contrive to enhance productivity and yield of a device at handling time by a method wherein the fingers on a film carrier are fixed up to directly before bonding of the device. CONSTITUTION:At a film carrier 1, when bonding of a device is to be performed, a loading hole 4 for loading of the device 5 is formed at the preliminary process thereof. Film parts 1' for fixation of fingers and surplus length parts for support and fixation of the fingers 3a', 3b' are formed by blanking according to a mold, for example. The fingers 3a', 3b' necessary for bonding and made the tip thereof to let free are formed according to blanking thereof. Because the fingers 3a', 3b' thereof are fixed up the directly before bonded to the device 5 to be loaded, generation of the scattering condition of the fingers 3a', 3b' according to external pressure to be caused due to inadvertent handling at handling time of the film carrier 1 can be checked. |
