| 摘要 |
PURPOSE:To prevent the movement of an external lead frame, and to obviate the generation of the deterioration of an element by fixing a semiconductor chip and a metallic piece having conductivity to a metallized layer, bonding a wire on the metallic piece and fitting lead or a lead group alloy to a surface opposite to the metallized layer. CONSTITUTION:Lead or a lead alloy group metal 21 is mounted to a surface opposite to a metallized layer formed to a package substrate of a conductive metallic piece 20. Structure in which a terminal chip 20 can be bonded on the metallized layer at a temperature of approximately 320 deg.C is obtained by using the terminal chip 20 having such structure. Accordingly, the movement of an external lead frame bonded on the upper surface of a package base body is prevented, and the possibility of the deterioration of the characteristics of a semiconductor element can be obviated because glass having a low sealing temperature is used. |
