发明名称 METHOD OF MOLDING SANDWICH
摘要 PURPOSE:To obtain the titled molded item inexpensively, by applying previously a powdery material for a skin layer to all the surfaces of molds, and injecting a material for a core layer into the molds, in a method wherein a synthetic resin that has been heated and plasticized is injected into molds, and after the molded item is cooled to solidify, the molds are opened to remove the item. CONSTITUTION:Previously a positive direct current high voltage is applied to both mold surfaces 2, 4 and a negative direct current high voltage is applied to an apparatus for spouting a material for a skin layer that is inserted between the mold surfaces so that static electric lines of force are generated between them, and a charged material for a skin layer is allowed to adhere to the mold surfaces 2, 4. Then a movable mold 1 is engaged with a stationary mold 3 to close the molds, and a material for a core layer is injected to be loaded into a cavity formed between the mold surfaces 2, 4 of the molds 1, 3. After the material for a core layer has gradually melted the previously adhered material for a skin layer by the heat of the former material, both the materials are allowed to cool and solidify. Thus a sandwich molded item comprising the skin layer material that covers all the core layer material can be obtained. EFFECT:The thickness of the skin layer can be made thin and uniform.
申请公布号 JPS6025718(A) 申请公布日期 1985.02.08
申请号 JP19830134625 申请日期 1983.07.23
申请人 MATSUSHITA DENKO KK 发明人 IWAMI SHIGEO;IDATE HIDENORI;OKANO TOMIYOSHI;UENISHIKUBO TERUAKI
分类号 B29C45/16;B29C45/14 主分类号 B29C45/16
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