| 摘要 |
A device for dissipating the heat losses of electrical assemblies. The heat-generating components (6) of an electrical assembly are arranged on a large-area support (25), which is supported such that it can move relative to a housing outer wall (21) and which, during the attachment of the assembly front panel (8), is pressed against a contact part (26) which is mounted on the inner surface of the outer wall (21), or against the outer wall (21) itself. In consequence, a heat-conducting connection is produced between the components and the housing outer wall, which can be cooled. The invention is suitable for heat dissipation from assemblies, for example for power supplies. <IMAGE>
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