发明名称 CONTINUOUS PLATING METHOD FOR METALLIC HOOP
摘要 PURPOSE:To eliminate the need for a separate flux tank and to reduce the size over the entire part of a device with a method for pressing a moving metallic hoop to the outside circumferential surface of a rotary coating roll dipped in a molten metal by floating a liquid flux on the molten metal. CONSTITUTION:For example, a hoop 11 is let off by pinch rollers 14 to the right in the case of forming a thin solder film 12 on the central part in the transverse direction on one surface of the hoop 11. The hoop 11 is pressed to the outside circumferential surface at the top end of a coating roll 18 of which the lower part is dipped in the molten solder 15 in a treating tank 16 and which is rotated by a motor 20, thereby forming continuously a film 12 of the width corresponding to the width of the roll 18. A flux 25 to be made into liquid is floated on the surface part of the solder 15 which is kept melted by a heater 21. The most of the solder 15 scooped up by the roll 18 is stuck to the surface of the hoop 11 by the effect of the flux 25 and therefore uneven coating is prevented and the need for providing specifically a flux storage tank is eliminated.
申请公布号 JPS6024363(A) 申请公布日期 1985.02.07
申请号 JP19830130859 申请日期 1983.07.20
申请人 SUMITOMO DENKI KOGYO KK 发明人 ISHIGURO SHINGO
分类号 B23K1/08;C23C2/00;C23C2/30 主分类号 B23K1/08
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