发明名称 |
SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING SAME |
摘要 |
<p>An electronic component comprises a mounting substrate (13) having a surface provided with a plurality of spaced contact pads (15) and a semiconductor chip (10); having at least one active element (11) and a surface provided with metallised contact regions (14). The metallised contact regions (14) are superimposed on and electrically conductively bonded to a different one of the mounting substrate contact pads (15). <??>The method comprises the forming on a surface of a semiconductor chip at least one active device having a raised metallised contact region and at least one additional raised contact region spaced from the active device contact region. A metallised contact pad for each of the raised contact regions is provided on a mounting substrate their spacing corresponding to the spacing of the raised contact regions. The contact pad for each active device is arranged to form part of a conductor connection. The chip is positioned on the mounting substrate with the associated raised contact regions and contact pads in mutual contact and they are electrically conductively bonded together. </p> |
申请公布号 |
JPS6024048(A) |
申请公布日期 |
1985.02.06 |
申请号 |
JP19840068368 |
申请日期 |
1984.04.05 |
申请人 |
PURETSUSHII OOBAASHIIZU LTD |
发明人 |
RIKAADO SHIMON SASUMAN;ROBAATO CHIYAARUZU GUTSUDOFUEROU |
分类号 |
G02B6/42;H01L21/60;H01L21/603;H01L23/482;H01L29/06;H01L31/0203;H01L33/58 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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