| 摘要 |
PURPOSE:To increase the heat dissipating efficiency by a method wherein a package is uniformly pressed by the elastic force of a fixing metal fitting, when the titled semiconductor is mounting on a heat dissipating plate via heat dissipating fitting plate and leg section, and is then clamped with the fitting. CONSTITUTION:This semiconductor is housed in the package 1a while projecting out lead terminals 2 provided therein, and is fixed with the metal fitting 12 with the back of the semiconductor abutting against the heat dissipating plate 6 via fitting plate 3 and leg section 7. At this time, the metal fitting is made of a Z-shaped elastic metallic plate consisting of a leg seat having an insertion hole 14a for set screw, a leg section 13, branched both side tongue holders 15a and 15c, and a short holder 15b positioned therebetween. Thereafter, a set screw 10 going into the plate 6 is inserted into the hole 14a, and then the surface of the package 1a is pressed with the holders 15a-15c. |
