| 摘要 |
PURPOSE:To facilitate an operation of fixing a pellet to a package and reduce the dispersion of thermal resistance by composing a metal structure of the back of the element of a three-layer structure of Au-Ni-Au. CONSTITUTION:After an element of a surface of a gallium arsenide FET is formed, the thickness of the gallium arsenide 4 is adjusted and a gold plating 5 is applied to the back. After a nickel plating 6 is applied, a gold plating 7 is again applied. Thne this pellet is fixed to the package by Au/Sn solder. By the three-layer structure of Au-Ni-Au like this, the pellet is easily fixed to the pellet and the dispersion of the thermal resistance of the element is reduced. |
