| 摘要 |
PURPOSE:To improve accuracy and reliability by a method wherein needle mark traces of 2 or more chips are added to a pad of a chip to be measured and the marks 2 of 2 or more chips are recognized and compared with each other to perform self-correction automatically. CONSTITUTION:A semiconductor wafer 1 is fixed on a mounting table 3 which moves to the X-axis, Y-axis and Z-axis directions and rotates along the circumference direction with the Z-axis as the center of rotation. The position where a probe card needle 2 touches the pad 5 of the chip 4 is nominated as the point O and the position where the needle mark traces are recognized is nominated as the point P. The needle 2 touches the chip 4 and adds a needle mark R on the pad 5. Then the probe card needle part is shifted to the left from the point O and the needle mark trace R' is added. Then the chip 4 is transferred to the designated position by the rotation of an X-axis motor. Then another one needle mark trace R is added. Then the chip is transferred to the point P. At the recognition point P, two handle mark traces actually added are recognized and compared with each other. The inclination and discrepancy of parallel lines at that time are calculated and automatically corrected. |
