发明名称 BONDING METHOD
摘要 PURPOSE:To carry out the bonding operation in high efficiency, preventing the adhesion of dust, etc. to the bonding surface, by bonding a light-transmitting plate to a molded article interposing a photo-crosslinking pressure-sensitive adhesive layer containing photo-crosslinking sensitizer, and irradiating the assembly with light from the side of the transparent plate to eliminate the tackiness of the exposed part. CONSTITUTION:A molded article (e.g. metallic or plastic rim or frame, etc.) is bonded to a part of a light-transmitting plate (e.g. an acrylic resin plate having a light-transmittance of 30-90% at 1,500-6,000Angstrom wavelength) using a photo- crosslinking pressure-sensitive adhesive layer containing a photo-crosslinking sensitizer (e.g. benzophenone), and the bonded assembly is irradiated with light from the side of the transparent plate to eliminate the tackiness of the adhesive layer to which the molded article is not bonded. The photo-crosslinking pressure-sensitive adhesive layer is preferably a laminated sheet containing a light- transmitting substrate such as a polyester film in the layer. EFFECT:The number of bonding steps, cost, and necessary period for bonding can be reduced.
申请公布号 JPS6023468(A) 申请公布日期 1985.02.06
申请号 JP19830131448 申请日期 1983.07.18
申请人 NITTO DENKI KOGYO KK 发明人 SATSUMA MICHIO;IJICHI ICHIROU;KANAI KAZUTO;NAKAGIRI TOSHIO
分类号 C09J5/00;B29C65/52;B29L9/00;C08J5/12;C09J5/06 主分类号 C09J5/00
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