| 发明名称 |
Ceramic substrate with metal plate |
| 摘要 |
A ceramic substrate with metal plate, wherein a metal plate consisting mainly of copper is bonded to a ceramic substrate through a brazing layer consisting of a mixture of copper oxide and copper.
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| 申请公布号 |
US4497875(A) |
申请公布日期 |
1985.02.05 |
| 申请号 |
US19830464945 |
申请日期 |
1983.02.08 |
| 申请人 |
HITACHI, LTD. |
发明人 |
ARAKAWA, HIDEO;KUNIYA, KEIICHI;CHIBA, AKIO;SHIMIZU, SEIKI |
| 分类号 |
H05K3/44;B23K35/30;B32B15/04;C04B37/00;C04B37/02;H01L21/52;H01L23/14;H01L23/15;H05K3/38;H05K7/20;(IPC1-7):H05K1/02 |
主分类号 |
H05K3/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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