| 摘要 |
A cabinet assembly or enclosure which provides an electronically and thermally benign environment for printed circuit boards and the electronic components carried thereby. A wire program device operable from the front of the cabinet permits a changeable interface between the circuits within the cabinet and an external wiring harness. Thermal management for plural solid state power controllers or other heat generating components is achieved through the wire program, and from the use of metal printed circuit boards clamped to a cold plate within the cabinet. A coolant from a remote source may be circulated through the cabinet in contact with the cold plate. The electrical, thermal and mechanical connections are of the zero insertion force type. A novel circuit board for solid state power controllers is also disclosed as is the thermal management of such controllers.
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