发明名称 MANUFACTURE OF SEMICONDUCTOR PACKAGE WITH CAPACITOR
摘要 PURPOSE:To simplify a process and reduce a manufacturing cost by adopting the same raw material for a package and a capacitor. CONSTITUTION:A capacitor internal electrode is formed on a base green sheet 11 whose main component is alumina by printing of metallized paste. Capacitor internal electrodes are also formed on laminar green sheets 13-19 whose main component is alumina by printing. The sheets 13-19 are laminated and bonded on the sheet 11 to form a capacitor part. An island printed plane 22 and an external lead out wiring 22a are formed on a green sheet 21. Green sheets 23, 26 are laminated and bonded on the sheet 21 to form a package part. The package part is mounted on the capacitor part and both parts are sintered and solidified, integrally.
申请公布号 JPS6022346(A) 申请公布日期 1985.02.04
申请号 JP19830130616 申请日期 1983.07.18
申请人 NIPPON TOKUSHU TOGYO KK 发明人 MIYAWAKI NOBUHIKO;MORIKAWA ASAO;KANBE ROKUROU;SHIROMIZU HISAHARU
分类号 H01L23/12;H01L23/64;H01L25/00 主分类号 H01L23/12
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