发明名称 |
MANUFACTURE OF SEMICONDUCTOR PACKAGE WITH CAPACITOR |
摘要 |
PURPOSE:To simplify a process and reduce a manufacturing cost by adopting the same raw material for a package and a capacitor. CONSTITUTION:A capacitor internal electrode is formed on a base green sheet 11 whose main component is alumina by printing of metallized paste. Capacitor internal electrodes are also formed on laminar green sheets 13-19 whose main component is alumina by printing. The sheets 13-19 are laminated and bonded on the sheet 11 to form a capacitor part. An island printed plane 22 and an external lead out wiring 22a are formed on a green sheet 21. Green sheets 23, 26 are laminated and bonded on the sheet 21 to form a package part. The package part is mounted on the capacitor part and both parts are sintered and solidified, integrally. |
申请公布号 |
JPS6022346(A) |
申请公布日期 |
1985.02.04 |
申请号 |
JP19830130616 |
申请日期 |
1983.07.18 |
申请人 |
NIPPON TOKUSHU TOGYO KK |
发明人 |
MIYAWAKI NOBUHIKO;MORIKAWA ASAO;KANBE ROKUROU;SHIROMIZU HISAHARU |
分类号 |
H01L23/12;H01L23/64;H01L25/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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