| 摘要 |
PURPOSE:To enable a polishing work excellent in efficiency and operability and improve availability by providing a plate load/unload mechanism concentratively extracting multiple polishing plates holding objects to be polished to one operation surface side of a polisher. CONSTITUTION:Wafers 15 are manually fitted to polishing plates and held by vacuum adsorption; the polishing plates 14 at positions F, G are reversed by 180 deg. with a stationary reversing unit 11 and are pressed to a polishing disk 13; plates 14 at positions E, H are rotated by 90 deg. with a movile reversing unit 17, are moved on a shift guide 18, and are rotated by 90 deg. in the horizontal plane to be pressed to the polishing disk 13. In addition, a load is applied to individual plates 14 pressed to the polishing disk 13 to rotate the polishing disk 13, then the plates 14 held by arms 20, 21 are rotated to follow it, and wafers 15 are polished. When polishing is completed, individual plates 14 are returned to their original positions in a reverse action to that when pressed to the polishing disk, the adsorption is released, and wafers are manually replaced. By repeating these actions, the availability of the device can be improved. |
