| 摘要 |
PURPOSE:To reduce power consumption for sputtering by pushing a substrate against an etching electrode in the upper section of an etching chamber having approximately the same diameter as the substrate by a sheet and sputtering the substrate. CONSTITUTION:Regarding a swing arm 14, a holder 12 is extracted from a cassette case 6 in a substrate receiving chamber 1 through an opening 5 first, and revolved to the lower section of an etching electrode 3. A sheet 16 rises through the inserting hole 11a of a tray 11 in the upper section of the sheet, the holder 12 held by the swing arm 14 is lifted, a substrate 4 received in the holder is pushed against the etching electrode 3, and the swing arm 14 is revolved and retreated to the side. High-frequency power is applied to the electrode 3 and the lower surface of the substrate 4 is etched at that time, but the power is sufficient when it generates a predetermined etching rate in the substrate 4, and power consumption may be comparatively small. |
