| 摘要 |
PURPOSE:To prevent a contact with a pad due to the deflection of a wire by forming a section easy to be brought into contact with the wire of a pad fringe section, on which a chip is fixed, in blanking structure. CONSTITUTION:A section positioned just under a wire 3 in the fringe section of a pad 1, a section 6 easy to be brought into contact with the wire due to the deformation of the wire, is drawn. The drawn section is not necessarily formed just under the whole wire, and may be limited particularly only to the section just under the wire easy to generate accidents on contacts due to deformation. Defectives are not generated through contacts between the wire 3 and the pad 1 because the pad 1 just under the wire is notched even when the wire 3 is deformed by forming the pad 1 in such structure. When there is the possibility of contacts between the wire 3 and the chip 2 due to the deformation of the wire 3, contacts between the wire 2 and the end section of the chip 2 can be prevented when a heat-resistant organic resin such as polyimide resin or an insulating supporter 7 such as thick film glass is fitted previously to the fringe section of the chip 2. |
