发明名称 SEMICONDUCTOR DEVICE AND MOUNTING THEREOF
摘要 PURPOSE:To increase the numbers of external leads markedly for lessening the danger of solders between adjoining external leads coming into contact with one another by a method wherein the external leads are alternately projected from the sides and either from surface or bottom of a package. CONSTITUTION:The external side leads 5 and the external bottom leads 6 respectively projecting from sides and bottom of a sealed resin are alternately arranged. Assuming the pitch of external leads 6 and the individual pitch of leads 5 and 6 to be a and b, said pitches are arrangd to be a = 1/2 X b. In such a constitution, the members of external leads 5 and 6 can be markedly increased so that the danger of solders between adjoining lead 5 and 6 coming into contact with one another may be lessened.
申请公布号 JPS62262448(A) 申请公布日期 1987.11.14
申请号 JP19860104985 申请日期 1986.05.09
申请人 MATSUSHITA ELECTRONICS CORP 发明人 NAKAGAWA SHOICHI
分类号 H01L23/50;H01L23/495;H05K3/34 主分类号 H01L23/50
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