| 摘要 |
PURPOSE:To limit the size of burr by arranging a plurality of light emitting parts on a wafer with narrowing the interval only of the predetermined scribing position compared with that of other position for performing scribing. CONSTITUTION:On the wafer 1 such as of GaAs, GaAsP, etc., a plurality of light emitting parts 2, 2... are aligned by diffusion or the like and these parts are provided with the electric supply paths 3, 3... consisting of Al or the like by vapor deposition and so on. At this time, for example, the light emitting parts 2, 2... each side of which is 50mum are aligned in intervals d1 of 100mum. However, in the predetermined scribing position 4, the interval d2 is 70-80mum. The predetermined scribing positions 4, 5 and 5 are made a cut by a diamond scriber and are applied a pressure to be divided. If the predetermined scribing position 4 is made to be accordance with a cleavage plane of the crystal, the room in the connection part of maximum 30mum and minimum 10mum can be obtained when light emitting diodes 6, 6... are cut by scribing, so that connecting arrangement with keeping the light emitting parts 2, 2... in equal intervals becomes possible. Also, if a back electrode is arranged with missing the predetermined dividing position intentionally, the burrs are reduced. |
