| 发明名称 |
Variable width ic bond pad arrangement. |
| 摘要 |
<p>The bond pads (22) for a ceramic package (10) are deposited on the pre-fired ceramic with the bond pad widths (47) increasing as a function of the distance (49) of each pad from the center of package mass (40) whereby bond pads at the extremity (36) of the package have the largest pad width and pads toward the center (40) of the package have the narrowest width.</p> |
| 申请公布号 |
EP0265367(A1) |
申请公布日期 |
1988.04.27 |
| 申请号 |
EP19870630206 |
申请日期 |
1987.10.15 |
| 申请人 |
UNITED TECHNOLOGIES CORPORATION |
发明人 |
CUSACK, MICHAEL DAVID |
| 分类号 |
H01L23/12;H01L21/48;H01L21/60;H01L23/498;H05K1/03;H05K1/11;H05K3/34;(IPC1-7):H01L21/48;H01L23/48 |
主分类号 |
H01L23/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
