| 摘要 |
<p>A multilayer ceramic copper circuit board was produced by forming a multilayer structure comprising layers of copper-based paste patterns and layers of glass-ceramic. The glass-ceramic consisted of a mixture of 3% to 75% by weight of mullite, 25% to 97% by weight of borosilicate glass having a softening temperature of at least 720 DEG C, and 0% to 70% by weight of quartz glass, based on the total weight of the glass-ceramic, and blended with a binder composition containing a thermally depolymerizable resin. The multilayer structure was prefired in an inert atmosphere containing water vapor and having a partial pressure of 0.005 to 0.3 atmosphere, at a temperature at which the thermally depolymerizable resin was eliminated, the multilayer structure was then fired in an inert atmosphere containing no water vapor at a temperature below the melting temperature of copper, to sinter the glass-ceramic.</p> |
