发明名称 METHOD FOR FORMATION OF LOW DENSITY LAYER ON SEMICONDUCTOR SUBSTRATE
摘要 PURPOSE:To easily obtain the low density layer in an excellent reproducible manner by a method wherein the surface of a semiconductor substrate is covered by a protective material and a heat treatment is performed on the substrate. CONSTITUTION:A CVD SiO2 film of 500 deg.C is superposed on an Sb-added N type Ge 11, and when a heat treatment is performed at 650 deg.C for 36hr using a vacuum sealing method, a low density region 10 can be formed in the vicinity of the surface without roughening the surface of the substrate. Then, Be ions and B ions are implanted, and a protective ring 13 and a P<+> layer 12 are formed by performing a process at 650 deg.C in N2 for 30min. Subsequently, a CVD SiO2 film 14 is covered, and a P-side Al electrode 15 and an N-side AuGe electrode 16 are attached. According to this kind of constitution, a low density layer 10 can be accomplished in an excellent reproducible manner, and the generation of recombination center on the obtained P<+>N<-> type Ge avalanche photodiode is markedly reduced, thereby enabling to eliminate the deterioration of voltage and current characteristics.
申请公布号 JPS6018974(A) 申请公布日期 1985.01.31
申请号 JP19830126717 申请日期 1983.07.12
申请人 NIPPON DENKI KK 发明人 TASHIRO YOSHIHARU
分类号 H01L31/0248;H01L21/223;H01L31/107;(IPC1-7):H01L31/10;H01L21/316 主分类号 H01L31/0248
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