| 摘要 |
PURPOSE:To upgrade the uptake rate of light of a semiconductor laser by a method wherein a solder reservoir consisting of a hole penetrated through a submount mounting region of a heat block is provided, a solder is filled up therein and heated, and the solder is applied to a submount by utilizing a capillarity. CONSTITUTION:A several-mm. diameter solder reservoir 17 has been provided in advance in the center of a submount mounting region, where is located at one end side of the main surface of a heat block 4 and whereon a submount is installed. A solder is previously filled up in the solder reservoir 17 and the solder is melt by heating, while a fused solder is sucked in the solder reservoir 17 from the lower direction of the solder reservoir 17 by a vacuum tool 18 and the solder is made to slightly swell upwards. Then, when the submount 2 held by a collet, etc., is positioned in such a way as to be placed on the mounting region, the solder 3 proceeds through the gap between the heat block 4 and the submount 2 by a capillarity and reaches the circumferential edge from the lower surface of the submount 2. By this method, the solder is prevented from overflowing from the circumferential edge. |
