| 摘要 |
PURPOSE:To prevent the cracks of a glass plate of window on the treatment of a semiconductor device by attaching a transparent resin on the surface of a semiconductor element and mounting a quartz board, a sapphire board or a glass plate on the transparent resin. CONSTITUTION:A semiconductor element 13 is set up to a lead frame 12, and sealed with a transparent resin 11, and a glass plate 14 is pasted on the surface side of the element 13 of the resin 11. Accordingly, the resin 11 is attached on the surface of the element 13, and a glass window is formed on the resin 11, thus preventing the cracks of the glass window on the treatment of a semiconductor device. |
