THERMAL HEAD FOR THERMOSENSITIVE RECORDING

摘要

PURPOSE:To improve the reliability and the heat radiating property along with a smaller size by providing a cover having a function of retaining a matrix connection section of a film lead with an opening formed at a part thereof. CONSTITUTION:A matrix connection section 21a on a film lead 21 is retained with a retaining section 23a provided in a cover 23 and is shut out of an external force such as bending during the handling to prevent disconnection at the connection section 21a. The matrix connection section 21a is built into the cover 23 to enable the bending of the film lead 21 exposed from the cover 23 at any position thereby making lessening of the outline of the thermal head. In addition, an opening 23b is provided at a part of the cover 23 and the retaining section 23a to promote the heat radiation of a semiconductor element 4. This makes the thermal head smaller while elevating the reliability with a higher heat radiating property.