| 摘要 |
PURPOSE:To moistureproof-seal a ceramic substrate and loaded parts completely by hermetically sealing an article, in which the ceramic substrate, the loaded parts and a melted resin are integrated, by a square-shaped package of the same shape. CONSTITUTION:The surface 2a on which loaded parts 3 on a ceramic substrate 2 are mounted is directed downward, a powdered resin 81a is placed on the surface 2b on which the parts 3 are not loaded, and heated and the whole surface of the surface 2b is coated with a melted resin 81b, an upper surface thereof is flat. On the other hand, a powdered resin is charged into a mold 9, an upper section thereof is opened, and melted up to a melted resin 82. The titled DIP type hybrid IC is inserted while downward directing the surface 2a. The resin 81b and the resin 82 are bridged under the state, and cured integrally. The DIP type hybrid IC is extracted from the mold 9 after curing, and hermetically sealed by a square-shaped package 83 of the same shape as the mold 9. Accordingly, a resin layer is formed in sufficiently thick thickness on the part 3 side in the shaped package 83, and pin holes are not generated. |
