| 摘要 |
<p>A wafer is adhered to a foil with an adhesive which is resistant, for a short time, to soldering temperature and the wafer is then divided into chips. After the soldering of the chip to a carrier strip, a pin or spindle beneath the chip penetrates the foil and removes the chip from the foil. The invention has the particular advantage that few method steps are necessary and that the soldering temperature may be synchronized exactly with the soldering operation.</p> |
