SUBSTRATE FOR SEMICONDUCTOR CHIPS

摘要

1. Substrate for semiconductor chips, with a) two groups of conductors (14a, 14c; 14d) being provided internally b) the conductors (14a, 14c) of the first group beginning and ending on the surface of the substrate (10) c) the conductors (14d) of the second group extending from the upper to the lower surface of the substrate and leading to connector pins (36) d) the conductor ends being arranged in patterns (20) repeated in the longitudinal direction of the substrate, said patterns being separated by strips (22) without conductor ends of the upper substrate surface e) part of the conductors (14c) of the first group extending within a pattern of conductor ends, characterized in that f) another part of the conductors of the first group serves for the connection of the adjacent patterns g) part of the conductor ends are connected via a surface metallization (26) to pads (24) for semiconductor chips, and another part to conductor ends of an adjacent pattern, and that h) a pattern of conductot ends can receive a plurality of different semiconductor chips and connect them to other semiconductor chips in the same pattern or in adjacent patterns.