SOLID-STATE IMAGE PICKUP DEVICE

摘要

PURPOSE:To simplify the manufacturing process of a solid-state image pickup element by integrating a photodetecting array where visible light detecting parts and infrared ray detecting parts are arranged alternately in the row or column direction and a mechanism which reads out the electric charges delivered from both detecting parts, on the main surface side of a sheet of semiconductor substrate. CONSTITUTION:A column direction array 3 of photodetecting part contains visible light detecting parts 1 and infrared ray detecting part 2 are set alternately in a row in the column direction with spaces secured between them. Such arrays 3 are set in the row direction with spaces. A charge reading mechanism 8 reads out successively the electric charges delivered from parts 1 and 2 and delivers them in the form of electric signals. These arrays 3 and the mechanism 8 are integrated on the main surface side of a sheet of semiconductor substrate. In such a constitution, both a visible light image and an infrared ray image are obtained with an object. Furthermore the cost of production is comparatively low despite addition of a visible light/infrared ray mechanism since just the forming process of the part 2 is added.