发明名称 |
Bath composition and method for copper-tin-zinc alloy electroplating |
摘要 |
An alkaline, cyanide, aqueous electroplating composition of copper, tin, and zinc includes a small amount of nickel to enhance the inclusion of tin in the copper-tin-zinc plate deposited from the solution. The plate resists tarnishing by a corrosion test solution, and retains its bright silvery-colored appearance because the plate preferably includes at least about 10.9 atomic wt % tin. The plating method for enhanced tin alloys through nickel additions to the bath is also described.
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申请公布号 |
US4496438(A) |
申请公布日期 |
1985.01.29 |
申请号 |
US19830508292 |
申请日期 |
1983.06.24 |
申请人 |
TEKTRONIX, INC. |
发明人 |
HELTON, RAYMOND L.;TROBOUGH, DOUGLAS W.;MCPHERSON, MARIANNE |
分类号 |
C25D3/58;(IPC1-7):C25D3/58 |
主分类号 |
C25D3/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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