发明名称 PELLET BONDING METHOD
摘要 PURPOSE:To obtain the same category and the same pattern element by placing complex frames in opposite direction with each other when a pellet is bonded on a frame of each line transferred intermittently along two groups of transfer lines in a state of continuous or specified length of complex frames formed integrally with plural number of leads. CONSTITUTION:All the pellets 1 which are facing upward in a state of wafer are transferred to an intermediate mounting position 2 by the first head 3A and some of the pellets are transferred to a lead frame of line A using the second head 3B without changing the direction. The other pellets are turned inversely by 180 deg. at the mounting position facing downward and transferred to a lead frame of line B by the second head 3B. In this way, the upwardly facing group and the downwardly facing group are bonded each with a wire by a device 4A or 4B, sent into a forming device 5 and sealed with the flow of resin in opposite direction whereby a sealed object of uniform quality is obtained.
申请公布号 JPS6016434(A) 申请公布日期 1985.01.28
申请号 JP19840104589 申请日期 1984.05.25
申请人 HITACHI SEISAKUSHO KK 发明人 MIMATA TSUTOMU;OZAWA MASAKAZU;SUMIYA OSAMU;SHIMIZU TAKESHI
分类号 H01L21/52;H01L21/58;(IPC1-7):H01L21/58 主分类号 H01L21/52
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