| 摘要 |
PURPOSE:To enable the miniaturization of the titled device by a method wherein stacking is carried out by sandwiching semiconductor elements in such a manner that the cutouts of cooling fins are alternately arranged. CONSTITUTION:The stacking is carried out by sandwiching the semiconductor elements 3 between the cooling fins 1 in such a manner that the cutouts of said fins are alternately arranged. In other words, an external connection wire is connected by the installation of a metallic fitting 2 for external terminal connection to the hole for said connection of the fin 1. At this time, the interval between the fins 1 can be shortened by the prevention of the contact of the fin 1 at the next stage with the fitting 2 with the cutout of the fin 1, leading to the reduction of the whole space. |
