| 摘要 |
PURPOSE:To obtain a molding of excellent strength advantageously without producing an internal stress, etc., by releasing a solid crosslinkable epoxy resin molding from a mold before the progress of crosslinking and completing its curing in a solid state while keeping the temperature of the atmosphere within a specified range. CONSTITUTION:A crosslinkable epoxy resin composition is molded in a mold by injection, extrusion, or the like, and the solidified resin molding of which the crosslinking reaction is not substantially advanced and which has a glass transition point (hereinafter, abbreviated as Tg) of 40-200 deg.C is released from the mold. The heat curing of the molding is carried out at an ambient temperature not higher than the Tg of the molding +20 deg.C, and the curing reaction is completed by raising the ambient temperature in accordance with the Tg of the molding which increases with the progress of the curing while the temperature is kept within the range not exceeding the Tg of the molding +20 deg.C. In this way, it becomes possible to perform mold release within a short time and to effect curing without deformation, etc. |
